WaferMill™ ion beam delayering solution在线离子束去层分析系统-半导体线上设备-上海微纳国际贸易有限公司

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WaferMill™ ion beam delayering solution在线离子束去层分析系统

型号：1063

Selected-area milling on full 300 mm wafers
Top-down delayering
Expose multiple device layers and structures
For use in multiple areas of a semiconductor fabrication facility:
– Research and development
– Process control
– Yield enhancement
– Failure analysis

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Selected-area milling on full 300 mm wafers
Top-down delayering
Expose multiple device layers and structures
For use in multiple areas of a semiconductor fabrication facility:
– Research and development
– Process control
– Yield enhancement
– Failure analysis

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